Go “Chip”! | JINGNENG’s SiC Power Chips Debut at the 2024 Beijing Auto Show

Jingneng’s first half-bridge module with GeePak plastic packaging, equipped with self-developed SiC chips, made its debut at Auto China 2024 (18th Beijing International Automotive Exhibition), attracting wide attention from the industry.

Highlights of GeePak Cutting-edge Innovative TechnologyGeePak：GeePak is a high-power-density, high-reliability product designed exclusively for main traction drives in premium electric vehicles.

High Performance：Actual current output exceeds 700 Arms, making it one of the highest current half-bridge modules in the industry.

Self-developed SiC chip：Equipped with Jingneng’s self-developed 14mΩ SiC chip, matching the world’s latest technologies.

Clip Bonding TechnologyClip：Offers an over 3-fold improvement compared with aluminum wire bonding.

Low Parasitic Inductance：Package compatible with 6-parallel / 8-parallel / 10-parallel SiC, module parasitic inductance below 5 nH.

Jingneng focuses on new energy chip design and module innovation.Adhering to a user-centric approach and technological innovation, it continuously provides differentiated and customized solutions and products covering materials, chips and modules.