Talent Development-Geener

Social Recruitment：Packaging Design Engineer

Job Type：R&D Category

Release Date：2025-10-10

Number of Openings：2 people

Work Location：Hangzhou, Zhejiang

Job Requirements：

1.Design and evaluate packaging solutions, coordinate internal and external resources to provide cost-effective and high-reliability packaging solutions for the company.
2.Collaborate with chip engineers to complete package outline design, lead frame design, substrate layout design, etc., ensuring optimized packaging design.
3.Perform packaging parameter extraction, thermal simulation and stress simulation.
4.Communicate with wafer manufacturers and packaging factories to jointly solve issues in the manufacturing process and ensure project progress; cooperate with packaging factories to improve and optimize process technology.
Job Requirements：

1.Master’s degree in Microelectronics, Electronic Information Science, Physics, Materials Science, Materials Processing Engineering, Electronic Packaging or related fields.
2.Familiar with packaging process equipment and properties of packaging materials; internship experience in major packaging factories is a plus.
3.Experience in power device packaging development; hands-on experience with FC packaging and CLIP packaging is preferred.
4.Strong logical thinking, excellent coordination and communication skills, and the ability to work under pressure.
5.Proficient in English reading and writing.

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Social Recruitment：Welding Engineer

Job Type：Engineering and Technical Field

Release Date：2025-10-10

Number of Openings：1 person

Work Location：Hangzhou, Zhejiang

Job Requirements：

1.Responsible for daily work related to SMT and soldering processes.
2.Draft and standardize process documents for SMT and soldering, including PFMEA, control plans, work instructions, OCAP, etc., and optimize equipment maintenance procedures and documents.
3.Manage and resolve abnormal issues during SMT and soldering processes.
4.Drive and lead improvement projects or tasks related to quality, yield, efficiency and cost for SMT and soldering processes.
5.Conduct training and certification for technicians and production operators.
6.Solve problems related to SMT and soldering processes and equipment performance to ensure stable production.
7.Cooperate with R&D teams to support new product introduction (NPI) activities.
8.Coordinate with other functional teams to promote and lead packaging process improvement projects.
9.Work with equipment engineers to optimize spare parts management, tool maintenance procedures and documents.
10.Understand the EHS management system and comply with EHS policies.
Job Requirements：

1.Bachelor’s or master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related fields.
2.At least 3–5 years of process experience in SMT or soldering for power modules.
3.Familiar with FMEA, SPC, Lean Six Sigma tools.
4.Able to use statistical tools to solve problems and further improve processes.
5.Ability to read and understand English technical documents, with basic English technical communication skills.
6.Strong knowledge of automation.

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Social Recruitment：Bonding Engineer

Job Type：Engineering and Technical Field

Release Date：2025-10-10

Number of Openings：1 person

Work Location：Hangzhou, Zhejiang

Job Requirements：

1.Responsible for daily work related to heavy aluminum / copper wire bonding and ultrasonic welding processes.
2.Draft and standardize process documents for heavy aluminum / copper wire bonding and ultrasonic welding, including PFMEA, Control Plan, Work Instructions, OCAP, etc., and optimize equipment maintenance procedures and documents.
3.Manage and resolve abnormal issues during heavy aluminum / copper wire bonding and ultrasonic welding processes.
4.Drive and lead improvement projects or tasks related to quality, yield, efficiency and cost for heavy aluminum / copper wire bonding and ultrasonic welding processes.
5.Conduct training and certification for technicians and production operators.
6.Solve problems related to heavy aluminum / copper wire bonding and ultrasonic welding processes and equipment performance to ensure stable production.
7.Cooperate with R&D teams to support new product introduction (NPI) activities.
8.Coordinate with other functional teams to promote and lead packaging process improvement projects.
9.Work with equipment engineers to optimize spare parts management, tool maintenance procedures and documents.
10.Understand the EHS management system and comply with EHS policies.
Job Requirements：

1.Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or other related fields.
2.At least 3–5 years of process experience in heavy aluminum/copper wire bonding or ultrasonic welding for power modules.
3.Familiar with FMEA, SPC, and Lean Six Sigma tools.
4.Able to use statistical tools to solve problems and further optimize processes.
5.Ability to read and understand English technical documents, with basic English technical communication skills.
6.Strong knowledge of automation.

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Social Recruitment：Potting Engineer

Job Type：Engineering and Technical Field

Release Date：2025-10-10

Number of Openings：1 person

Work Location：Hangzhou, Zhejiang

Job Requirements：

1.Responsible for the daily operations of enclosure assembly and potting processes.
2.Draft and standardize process documents for enclosure assembly and potting (e.g., PFMEA, Control Plan, Work Instructions, OCAP), and optimize equipment maintenance procedures and documentation.
3.Manage and resolve abnormal issues occurring during the enclosure assembly and potting processes.
4.Drive and lead improvement projects or tasks related to quality, yield, efficiency, and cost for enclosure assembly and potting processes.
5.Conduct training and certification for technicians and production operators.
6.Solve problems related to enclosure assembly & potting processes and equipment performance to ensure stable production.
7.Cooperate with R&D teams to support New Product Introduction (NPI) activities.
8.Coordinate with other functional teams to promote and lead packaging process improvement projects.
9.Work with equipment engineers to optimize spare parts management, as well as tool maintenance procedures and documentation.
10.Understand the EHS management system and comply with EHS policies.
Job Requirements：

1.Bachelor’s or master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or other related fields.
2.At least 3–5 years of process experience in housing assembly or potting for power modules.
3.Familiar with FMEA, SPC, and Lean Six Sigma tools.
4.Able to use statistical tools to solve problems and further optimize processes.
5.Ability to read and understand English technical documents, with basic English technical communication skills.
6.Strong knowledge of automation.

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Social Recruitment：Process Manager

Job Type：Management

Release Date：2025-10-10

Number of Openings：1 person

Work Location：Hangzhou, Zhejiang

Job Requirements：

1、Arrange professional and safety training for process engineers; regularly conduct performance, technical capability and competency evaluation, assessment and ranking.
2、Organize the evaluation, introduction and validation of new processes, new materials and new equipment.
3、Organize product abnormality handling, capacity optimization and process document management.
4、Establish and optimize processes for new products, set parameters, develop and train on process flows and defect standards; monitor and continuously improve product yield online.
5、Confirm production line abnormalities, conduct root cause analysis and implementation, and define preventive measures.
6、Organize and promote continuous improvement projects for product quality, productivity and cost.
7、Manage quality and information security control.
8、Support customer audits, respond to customer inquiries, implement improvements and standardize documents per customer requirements.
9、Organize weekly process meetings, summarize experiences, set plans and report to supervisors.
Job Requirements：

1、Bachelor’s or master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or other related fields.
2、At least 8 years of process experience and more than 2 years of management experience.
3、Proficient in Office software, CAD or 3D drawing software.
4、Familiar with FMEA, SPC, and Lean Six Sigma tools.
5、Ability to read and understand English technical documents, with basic English communication skills in technical fields.
6、Strong knowledge of automation.
7、Strong logical thinking, good internal/cross-departmental communication and coordination skills, and solid work promotion capabilities.

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Social Recruitment：Equipment Engineer

Job Type：Engineering and Technical Field

Release Date：2025-10-10

Number of Openings：1 person

Work Location：Hangzhou, Zhejiang

Job Requirements：

1、Responsible for equipment hoisting, handling, secondary connection, installation and acceptance.
2、Responsible for establishing and improving equipment management systems, maintenance systems, as well as collecting, sorting and filing technical documents.
3、Responsible for formulating and implementing annual, quarterly and monthly equipment maintenance plans, and maintaining maintenance records.
4、Responsible for inspecting, recording, assessing and daily managing the operation of various equipment in the department.
5、Responsible for troubleshooting equipment, analyzing faults, providing solutions, reporting major faults to supervisors in a timely manner, and submitting accurate statistical reports on schedule.
6、Responsible for implementing continuous improvement projects and TPM, optimizing equipment UDT, and achieving targets such as Uptime, MTTR and MTBF.
7、Responsible for developing equipment safety operation procedures and training operators.
8、Assist supervisors in formulating new equipment procurement and investment plans, and organize equipment selection, purchase and acceptance as required.
9、Organize the introduction and implementation of automation-related equipment according to process and technical requirements.
10、Understand the EHS management system and comply with EHS policies.
Job Requirements：

1、College or bachelor’s degree in Mechanical, Engineering, Automation or related fields.
2、More than 5 years of working experience in equipment maintenance and management in related industries.
3、Familiar with the structure and principles of engineering machinery, with experience in mechanical troubleshooting, design and maintenance; knowledgeable in equipment maintenance processes, specifications and standards.
4、Capable of equipment maintenance, troubleshooting and on-site work; proficient in office software and AutoCAD.
5、Good communication, coordination skills and team spirit.
6、Ability to read and understand English technical documents, with basic English communication skills in technical fields.
7、Strong knowledge of automation.

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Social Recruitment：Equipment Manager

Job Type：Management

Release Date：2025-10-10

Number of Openings：1 person

Work Location：Hangzhou, Zhejiang

Job Requirements：

1、Oversee overall work of the Equipment Department; formulate, revise, inspect, coordinate, supervise, and implement post responsibilities for workshop equipment; clarify duties, authorities and workflows of each position, and ensure full completion of departmental tasks.
2、Arrange professional and safety training for equipment engineers; regularly evaluate, assess and appraise their performance, technical competence and working ability.
3、Coordinate and manage hoisting, handling, secondary connection, installation, acceptance and other processes of production equipment to ensure on-time deployment.
4、Manage and participate in daily equipment maintenance, troubleshooting and disposal.
5、Lead equipment engineers to implement continuous improvement projects and TPM; optimize equipment UDT and achieve targets for Uptime, MTTR, MTBF, etc.
6、Establish a production equipment maintenance documentation system (maintenance manuals, operation instructions, safety procedures, etc.) and promote smooth implementation.
7、Cooperate with process and product teams to ensure on-time completion of new product process validation and mass production launch.
8、Conduct weekly summaries of equipment operation; organize weekly department meetings, summarize experience, set plans and report to supervisors.
Job Requirements：

1、Familiar with common process and support equipment for one or more processes in semiconductor packaging & testing factories, including soldering, bonding, assembly, potting, molding, trim & form, and testing.
2、Bachelor’s degree or above in mechanical, electronic, electrical, automation or other related engineering majors.
3、At least 5 years of equipment maintenance experience and more than 2 years of management experience.
4、Proficient in Office software, CAD or 3D design software.
5、Ability to read and understand English technical documents, with basic English communication skills for technical topics.
6、Strong logical thinking, good internal and cross-departmental communication and coordination skills, and solid project execution capability.

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Social Recruitment：Test Engineer

Job Type：Engineering and Technical Field

Release Date：2025-10-10

Number of Openings：1 person

Work Location：Hangzhou, Zhejiang

Job Requirements：

1、Develop packaging performance test plans and detailed test schemes; set up and maintain test environments, execute tests, and submit test reports.
2、Analyze and accurately locate issues found during testing; propose product improvement suggestions and evaluate the feasibility of improvement plans.
3、Summarize and statistically analyze test results, track testing progress and provide feedback to ensure test quality.
4、Establish maintenance plans and manuals for test equipment and failure analysis equipment.
5、Manage the maintenance, repair and daily upkeep of test equipment and failure analysis equipment.
6、Conduct test skill training and certification for test technicians and operators.
7、Cooperate with other departments on packaging performance testing for power semiconductors, including parametric testing and reliability testing.
Job Requirements：

1、Bachelor’s or Master’s degree in Microelectronics, Power Electronics, Integrated Circuits or related majors.
2、At least 8 years of working experience in the power semiconductor industry.
3、Familiar with principles and applications of semiconductor devices; understand product characteristics, test methods and packaging engineering of MOSFET and IGBT.
4、Able to use statistical tools to solve problems and further optimize processes.
5、Ability to read and understand English technical documents, with basic English communication skills in technical fields.
6、Strong knowledge of automation.
7、Outgoing personality, good communication and coordination skills, strong sense of responsibility and excellent execution ability.

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Social Recruitment：Production Supervisor

Job Type：Management

Release Date：2025-10-10

Number of Openings：1 person

Work Location：Hangzhou, Zhejiang

Job Requirements：

1、Collect and analyze data, formulate and implement action plans, conduct regular follow-ups to ensure timely task completion.
1）Improve quality, output and personnel efficiency;
2）Reduce production cycle time and human operation errors;
3）Manage abnormalities: deviation decision management and equipment safety release.
2、Manage and control production procedures, rules and regulations.
3、Track and evaluate the performance of each team and the execution of team leaders.
4、Ensure timely implementation of safety measures.
5、Identify production challenges, work with relevant engineers to propose improvement actions, and follow up on their implementation.
6、Handle or coordinate the resolution of various production abnormalities, and flexibly adjust production plans based on actual conditions.
7、Manage raw materials, semi-finished products, finished products and waste in the workshop to ensure inventory accuracy.
8、Manage the collection, registration, usage and scrapping of tooling and fixtures.
9、Manage and optimize production schedule, data statistics, staff morale, operation procedures and resource utilization.
10、Perform other tasks assigned by the Production Manager.Manage the five key production factors (Man, Machine, Material, Method, Environment) to ensure production targets are achieved on time and with qualified quality.
Job Requirements：

1、College diploma or above, majoring in Management or related fields.
2、At least 3 years of relevant working experience in production management.
3、Knowledgeable in 6S, Lean Production and Continuous Improvement.
4、Proficient in office software including Word, Excel and PowerPoint.
5、Excellent communication and conflict resolution skills.
6、Well-organized with proper working methods.

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Social Recruitment：Bonding Engineer

Job Type：Process Engineering

Release Date：2025-10-10

Number of Openings：1 person

Work Location：Wenzhou, Zhejiang

Job Requirements：

1、Responsible for daily work related to heavy aluminum / copper wire bonding and ultrasonic welding processes.
2、Draft and standardize process documents for heavy aluminum / copper wire bonding and ultrasonic welding, including PFMEA, control plan, operation instruction, OCAP, etc., and optimize equipment maintenance procedures and documents.
3、Manage and troubleshoot abnormal issues in heavy aluminum / copper wire bonding and ultrasonic welding processes.
4、Drive and lead improvement projects or tasks related to quality, yield, efficiency and cost for heavy aluminum / copper wire bonding and ultrasonic welding processes.
5、Conduct training and certification for technicians and production operators.
6、Solve problems related to heavy aluminum / copper wire bonding and ultrasonic welding processes and equipment performance to ensure stable production.
7、Cooperate with R&D team to support new product introduction activities.
8、Coordinate with other functional teams to promote and lead packaging process improvement projects.
9、Optimize spare parts management and tooling maintenance procedures and documents together with equipment engineers.
10、Understand the EHS management system and comply with EHS policies.
Job Requirements：

1、Bachelor’s or master’s degree in Mechanical, Materials, Electrical Engineering or other related fields.
2、At least 3–5 years of experience in heavy aluminum/copper wire bonding or ultrasonic welding processes for power modules.
3、Familiar with FMEA, SPC, and Lean Six Sigma tools.
4、Able to use statistical tools to solve problems and further optimize processes.
5、Ability to read and understand English technical documents, with basic English technical communication skills.
6、Strong knowledge of automation.

Submit Your Resume

Campus Recruitment：Packaging Design Engineer

Job Type：R&D Category

Release Date：2025-09-09

Number of Openings：2 people

Work Location：Hangzhou, Zhejiang

Job Requirements：

1.Evaluate packaging design solutions, coordinate internal and external resources to provide low-cost, high-reliability packaging solutions for the company.
2.Cooperate with chip engineers to complete package outline design, lead frame design, substrate layout design, etc., to ensure optimized packaging design.
3.Perform packaging parameter extraction, thermal simulation and stress simulation.
4.Communicate with wafer manufacturers and packaging factories to collaboratively solve problems in the manufacturing process and ensure project schedule; work with packaging factories to improve and optimize process technology.
Job Requirements：

1.Master’s degree in Microelectronics, Electronic Information Science and Technology, Physics, Materials Science, Materials Processing Engineering, Electronic Packaging or related fields.
2.Familiar with various packaging processes and equipment, understand the properties of packaging materials; internship experience in large-scale packaging factories is preferred.
3.Experience in power product packaging development; experience with FC packaging and CLIP packaging is preferred.
4.Excellent logical thinking, good communication and coordination skills, able to work under pressure.
5.Good English reading and writing skills.

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Social Recruitment：Test Engineer

Job Type：Process Engineering

Release Date：2025-09-09

Number of Openings：1 person

Work Location：Wenzhou, Zhejiang

Job Requirements：

1、Responsible for compiling packaging performance test plans, formulating detailed test schemes, building and maintaining test environments in accordance with test plans, conducting test work, and submitting test reports.
2、Responsible for detailed analysis and accurate positioning of problems found during testing, putting forward further improvement suggestions for products, and evaluating the rationality of improvement schemes.
3、Responsible for summarizing and statistically analyzing test results, tracking tests and providing feedback to ensure test quality.
4、Responsible for formulating maintenance plans and maintenance manuals for test equipment and failure analysis equipment.
5、Responsible for the maintenance, repair and management of test equipment and failure analysis equipment.
6、Responsible for the training and certification of test skills for test technicians and operators.
7、Cooperate with other departments in the packaging performance testing of power semiconductors, including the characteristic parameter testing and reliability testing of products.
Job Requirements：

1、Bachelor’s or Master’s degree in Microelectronics, Power Electronics, Integrated Circuits or related majors.
2、At least 8 years of working experience in the power semiconductor industry.
3、Familiar with principles and applications of semiconductor devices; understand product characteristics, test methods and packaging engineering of MOSFET and IGBT.
4、Able to use statistical tools to solve problems and further optimize processes.
5、Ability to read and understand English technical documents, with basic English technical communication skills.
6、Strong knowledge of automation.
7、Outgoing personality, good communication and coordination skills, strong sense of responsibility and excellent execution.

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Campus Recruitment：Equipment Engineer

Job Type：Engineering and Technical Field

Release Date：2025-09-09

Number of Openings：1 person

Work Location：Hangzhou, Zhejiang

Job Requirements：

1.Responsible for equipment maintenance and repair.
2.Responsible for component development and verification.
3.Responsible for equipment modification and upgrade.
4.Responsible for developing real-time equipment monitoring systems and automatic control systems, improving equipment stability, production efficiency and product yield, and reducing maintenance costs.
5.Responsible for equipment selection, installation, commissioning and routine maintenance to meet production requirements.
Job Requirements：

1.Bachelor’s degree.
2.Major in Mechanical Engineering, Automation, Electrical Engineering, Electronic Science and Technology, or related fields.

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Social Recruitment：Equipment Technician/Engineer

Job Type：Engineering and Technical Field

Release Date：2025-09-09

Number of Openings：1 person

Work Location：Wenzhou, Zhejiang

Job Requirements：

1. Familiar with packaging processes for discrete devices (TO220, TO263, TO252 MOSFET), and understand product characteristics and end applications of MOSFET.
2. Knowledge of equipment electrical systems, programming, etc.
3. Responsible for formulating, supervising and inspecting daily equipment maintenance plans.
4. Collect and summarize equipment failure analysis, and develop preventive measures.
5. Organize data from service life tests of process consumables and write test reports after data analysis.
6. Cooperate with R&D for engineering batch production, optimize WB process parameters and wire bonding methods.
Job Requirements：

1. Familiar with common process and support equipment for one or more processes in semiconductor packaging & testing factories, including DS, DA, WB, MD, FT.
2. Bachelor’s degree or above in mechanical, electronic, electrical, automation or other related engineering majors.
3. Proficient in office software and CAD or 3D design software.
4. Ability to read and understand English technical documents, with basic English technical communication skills.
5. Strong logical thinking, good internal and cross-departmental communication and coordination skills, and solid execution ability.
6. Fresh graduates are acceptable, starting as a technician.

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Campus Recruitment：Process Engineer

Job Type：Engineering and Technical Field

Release Date：2025-09-09

Number of Openings：1 person

Work Location：Hangzhou, Zhejiang

Job Requirements：

1.Drive R&D of module packaging processes and build core process platforms.
2.Explore and develop cutting-edge pre-research technologies.
3.Analyze equipment utilization and efficiency, build capacity models, and partner with Engineering to optimize stability and efficiency, boosting KPIs.
4.Support operational execution for advanced tech R&D and new product introduction (NPI).
Job Requirements：

1.Major: Industrial Engineering, Semiconductor, Electronics, Automation or other related science and engineering majors.
2.Competencies: Strong sense of responsibility and execution ability; good communication skills; clear logical thinking; solid data analysis and English skills.

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Social Recruitment：Sales Manager

Job Type：Management

Release Date：2025-09-09

Number of Openings：1 person

Work Location：Wenzhou, Zhejiang

Job Requirements：

1. Develop markets and maintain customer relationships, proactively achieve sales targets set by the company, and provide high-quality service to customers.
2. Conduct market development.
3. Perform customer service, communication and coordination.
4. Carry out information collection.
5. Provide after-sales service.
Job Requirements：

1. Develop markets and maintain customer relationships, proactively achieve sales targets set by the company, and provide high-quality service to customers.
2. Conduct market development.
3. Perform customer service, communication and coordination.
4. Carry out information collection.
5. Provide after-sales service.

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Campus Recruitment：Module R&D Engineer

Job Type：R&D Category

Release Date：2025-09-09

Number of Openings：1 person

Work Location：Hangzhou, Zhejiang

Job Requirements：

1.Responsible for technology development of power devices including IGBT, MOSFET, Super Junction, SiC, GaN, as well as IPM modules and PM modules.
2.Responsible for simulation, layout design, and process development of power devices or modules.
3.Responsible for developing application solutions and corresponding test plans for power devices or modules, and conducting test implementation and data analysis.
4.Responsible for formulating reliability plans and managing the quality control system for power devices or modules.
5.Explore cutting-edge technologies such as SiC and GaN, and conduct pre-research for next-generation power devices or modules.
Job Requirements：

1.Bachelor’s degree or above.
2.Major in Microelectronics, Physics, Semiconductor Devices, Materials Physics, Materials Science, Fluid Mechanics, Communication Technology, Electronic Science and Technology, Mechanical Automation, or other related fields.

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Social Recruitment：Process Development Position

Job Type：R&D Category

Release Date：2025-09-09

Number of Openings：1 person

Work Location：Hangzhou, Zhejiang

Job Requirements：

1. Responsible for formulating process development plans, conducting R&D of semiconductor packaging processes and material introduction.
2. Responsible for designing and implementing DOE (Design of Experiments) tests.
3. Cooperate with material R&D engineers to complete competitive product analysis.
4. Participate in product planning and formulate corresponding station Roadmaps for new product process development.
5. Cooperate with production line process engineers to introduce process parameters of new products into mass production.
Job Requirements：

1.Bachelor’s degree or above.
2.Expert in packaging process development & design; conversant with tooling/fixture design.
3.Strong background in power module packaging (Die Attach/Wire Bonding/Molding).
4.2+ years of relevant experience preferred. Requires hands-on single-process expertise and a holistic view of the entire workflow.

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Social Recruitment：Product Engineer

Job Type：R&D Category

Release Date：2025-10-10

Number of Openings：1 person

Work Location：Hangzhou, Zhejiang

Job Requirements：

1.Follow up on new product development progress including chip tape-out, module trial packaging, and new product testing; analyze, identify and resolve abnormalities during product development, including packaging and reliability issues.
2.Conduct new product evaluation, development and qualification; prepare, optimize and upgrade test specifications.
3.Prepare, review and update product specifications.
4.Track electrical testing and reliability tests of chips and packaged products, and complete analysis of test results.
5.Track and resolve quality and test issues at customer sites or testing institutions; provide technical communication and support to after-sales teams, and respond to customer technical inquiries.
6.Develop customer-customized products, provide customer requirement documents, and implement improvements for product issues raised by customers.
Job Requirements：

1.Bachelor’s degree or above.
2.Familiar with the technical principles, R&D processes and reliability requirements of IGBT, SiC and power modules; proficient in product parameters and test principles; skilled in failure analysis methods and processes.
3.Capable of developing product specifications and defining product specifications, with experience in tracking and managing product development progress.
4.At least 3 years of working experience in power module product development.

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