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Company Profile

Zhejiang Jingneng Microelectronics Co., Ltd. was founded in June 2022. It is the power and AI semiconductor platform of Geely Technology Group. Relying on the Group’s global industrial resources, the company has built a leading R&D and manufacturing system, serving key scenarios such as electric vehicles, sustainable energy and AI infrastructure. Adhering to the philosophy of “co-innovation with users”, Jingneng focuses on product and service development. It has established a multi-dimensional technology matrix covering chip design, module development and system integration, providing users with competitive and differentiated solutions. The company continues to drive the intelligent and green upgrading of the industry and empower the realization of energy freedom for mankind with core chip technologies.

Advanced Manufacturing Cluster

Three modern production bases have been established in Yuhang, Wenling, and Xiuzhou, integrating advanced equipment and high-level talent from various specialized fields worldwide. This has successfully enabled the research, development, and application of dozens of chips and modules, including Si-based MOS, IGBT, FRD, and SiC-based MOS.

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    Yuhang Base
    No. 1 Yanwan Road, Yuhang District, Hangzhou City, Zhejiang Province
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    Xiuzhou Base
    Intersection of Weisheng Road and Bazhi Road, Xiuzhou District, Jiaxing City, Zhejiang Province
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    Wenling Base
    No. 60, Chengxi Subdistrict, Wenling City, Taizhou City, Zhejiang Province
  • 2025
  • 2024
  • 2023
  • 2022

Development History

  • 2025
    • In July 2025, monthly shipments of automotive-grade SiC modules exceeded 10,000 units for consecutive months.

    • In May 2025, Si modules were officially mass-produced for the YuanCheng XingZhi H9M.

    • In May 2025, Si modules were officially mass-produced for models including Galaxy E5.

    • In April 2025, SiC modules were officially mass-produced for ZEEKR 001, 009, 7X and other models.

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  • 2024
    • In November 2024, the company obtained the IATF 16949 Automotive Industry Quality Management System Certification.

    • In October 2024, the company completed a Series B financing of 500 million yuan, with investment from Xiuzhou Linghang Fund.

    • In March 2024, the company’s first self-developed automotive‑grade SiC product successfully passed wafer taping out.

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  • 2023
    • In December 2023, the company completed its Series A+ financing, which was led by Wenling Jiulonghui, with participation from Yuhang State-owned Investment and Qianjiang Motorcycle.

    • In July 2023, two self-developed automotive-grade FRD products successfully passed wafer taping out.

    • In June 2023, the company completed its Series A financing, which was led by Gaorong Capital, with participation from Geely Capital, Xiamen C&D, and dozens of other institutions.

    • In May 2023, the expansion of the production line at the Wenling Base and the signing of the Xiuzhou Base construction project were completed.

    • In March 2023, the company’s first self-developed automotive-grade IGBT product successfully taped out.

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  • 2022
    • In November 2022, the company completed its Pre-A round financing, led by Walden International, with participation from Gaorong Capital, Sixin Investment, and other investors.

    • In June 2022, Jingneng signed an agreement with the Yuhang District Government, starting with the construction of a module factory and gradually expanding into chip design, system integration and other businesses.

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Company Honors

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Powering the New Energy Era with Quality Chips.

We provide innovative solutions across materials, chips and modules.