Advanced Manufacturing Cluster
Three modern production bases have been established in Yuhang, Wenling, and Xiuzhou, integrating advanced equipment and high-level talent from various specialized fields worldwide. This has successfully enabled the research, development, and application of dozens of chips and modules, including Si-based MOS, IGBT, FRD, and SiC-based MOS.
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Yuhang BaseNo. 1 Yanwan Road, Yuhang District, Hangzhou City, Zhejiang Province -
Xiuzhou BaseIntersection of Weisheng Road and Bazhi Road, Xiuzhou District, Jiaxing City, Zhejiang Province -
Wenling BaseNo. 60, Chengxi Subdistrict, Wenling City, Taizhou City, Zhejiang Province
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2025
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2024
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2023
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2022
Development History
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2025
In July 2025, monthly shipments of automotive-grade SiC modules exceeded 10,000 units for consecutive months.
In May 2025, Si modules were officially mass-produced for the YuanCheng XingZhi H9M.
In May 2025, Si modules were officially mass-produced for models including Galaxy E5.
In April 2025, SiC modules were officially mass-produced for ZEEKR 001, 009, 7X and other models.
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2024
In November 2024, the company obtained the IATF 16949 Automotive Industry Quality Management System Certification.
In October 2024, the company completed a Series B financing of 500 million yuan, with investment from Xiuzhou Linghang Fund.
In March 2024, the company’s first self-developed automotive‑grade SiC product successfully passed wafer taping out.
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2023
In December 2023, the company completed its Series A+ financing, which was led by Wenling Jiulonghui, with participation from Yuhang State-owned Investment and Qianjiang Motorcycle.
In July 2023, two self-developed automotive-grade FRD products successfully passed wafer taping out.
In June 2023, the company completed its Series A financing, which was led by Gaorong Capital, with participation from Geely Capital, Xiamen C&D, and dozens of other institutions.
In May 2023, the expansion of the production line at the Wenling Base and the signing of the Xiuzhou Base construction project were completed.
In March 2023, the company’s first self-developed automotive-grade IGBT product successfully taped out.
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2022
In November 2022, the company completed its Pre-A round financing, led by Walden International, with participation from Gaorong Capital, Sixin Investment, and other investors.
In June 2022, Jingneng signed an agreement with the Yuhang District Government, starting with the construction of a module factory and gradually expanding into chip design, system integration and other businesses.
Company Honors
Powering the New Energy Era with Quality Chips.
We provide innovative solutions across materials, chips and modules.