2024-11-14

Geely Automobile Unveils Innovative Power Semiconductor Platform; Jieneng, as a Partner, Announces Initial Achievements

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On November 4, the unveiling ceremony of the Geely Auto Power Semiconductor Technology Innovation Platform was successfully held. The event was co-hosted by the New Energy Development Center, Technology Planning Center, Electronics & Electricals Center, and Components Industry Center of Geely Auto Group Central Research Institute, together with industry component suppliers, semiconductor enterprises, universities, and research institutes.

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The establishment of the Geely Auto Power Semiconductor Technology Innovation Platform (hereinafter referred to as the “Innovation Platform”) represents a key step for Geely’s Spark Innovation Platform to take root in the new energy EV three-electrical systems sector.It marks that Geely Auto is deeply integrating technological strengths and resources from semiconductor enterprises, component suppliers, universities and research institutes, accelerating the R&D and application of third-generation wide-bandgap semiconductors, high-end MCUs, analog and digital chips in automotive applications, and laying a solid foundation for the leapfrog enhancement of its vehicle product competitiveness.


The Innovation Platform will focus on technological innovation, development and application of power semiconductors and high-end chips for new energy vehicles, small three-electrical systems, and hybrid powertrains.It brings together global leaders in power semiconductors, including STMicroelectronics, Silan Microelectronics, CRRC Times, and Jingneng Microelectronics. It also collaborates with Ningbo Research Institute of Fudan University to empower industrialization.Members possess leading wafer design capabilities and have established a complete semiconductor manufacturing and verification system, providing a solid foundation for the wide application and sustainable innovation of power semiconductors and related analog and digital chips.

At the inauguration ceremony, Lao K, the Platform Director, introduced the background, mission, organizational structure and operation mode of the Innovation Platform, and launched its first achievement: Taiyi Hybrid Power Device.As a platform-based solution jointly developed by initial platform partners including Jingneng and STMicroelectronics, the Taiyi Hybrid Power Device adopts a SiC & IGBT parallel design.It features a scalable peak power of 150–260 kW, an ultra-compact system size equivalent to an A4 sheet, and an output current capability exceeding 430 A.

Ren Xiangfei, Executive Deputy Dean of the Central Research Institute of Geely Auto Group, stated that with the advancement of electrification and intelligence, the industry is facing numerous technological challenges and opportunities, as well as a new landscape for the coordinated development of the semiconductor sector and automakers.Continuous innovation will enhance the performance and reduce the cost of Geely models, while elevating the coordinated industrial development to a new level.